T is the temperature in Kelvin
2.3.1.3 Dipole–Induced-Dipole Interaction
In the dipole–induced-dipole interaction, the presence of the partial charges of the polar molecule causes a polarization, or distortion, of the electron distribution of the other molecule. As a result of this distortion, the second molecule acquires regions of partial positive and negative charge, and thus it becomes polar. The partial charges so formed behave just like those of a permanently polar molecule and interact favorably with their counterparts in the polar molecule that originally induced them. Hence, the two molecules cohere with a potential energy V given by
where μ is the dipole moment of the polar molecule, α is the polarizability of non-polar molecule, and r is the distance between them.
2.3.1.4 Ion–Dipole Interaction
An ion-dipole force is an attractive force that results from the electrostatic attraction between an ion and a neutral molecule that has a dipole. It is most commonly found in solutions. It is especially important for solutions of ionic compounds in polar liquids. The potential energy of ion–dipole interaction is given by
where q is the charge on the ion.
One should note that in all the above equations describing the intermolecular attractions, the denominator contains the factor r6. Thus, the types of intermolecular interactions described above occur only at very small distances, of the order of typical atomic bond lengths (the range of non-bonding interactions is between 0.3 and 0.5 nm). For interactions to occur, therefore, the two materials must be able to make intimate contact with each other (i.e., they must be able to approach within a nanometer). This is possible if the adhesive wets the substrate efficiently. The types of interactions and the corresponding energies are given in Table 2.1.
Table 2.1 Bond types and typical bond energies [1].
| Type of interaction | Energy (kJ/mol) | Basis of attraction |
| Bonding | ||
| Ionic | 400–4000 | Cation–anion |
| Covalent | 150–1100 | Nuclei–shared electron pair |
| Metallic | 75–1000 | Cations–delocalized electrons |
| Non-Bonding | ||
| Ion–dipole | 40–600 | Ion charge–dipole charge |
| Hydrogen bonding | 10–40 | Polar bond to hydrogen–dipole charge |
| Dipole–dipole | 5–25 | Dipole charges |
| Ion–induced dipole | 3–15 | Ion charge–polarizable electrons |
| Dipole–induced dipole | 2–10 | Dipole charge–polarizable electrons |
| Dispersion forces | 0.1–40 | Interaction between polarizable electrons |
2.3.1.5 Hydrogen Bonds
This is an important intermolecular interaction specific to molecules containing an oxygen, nitrogen, or fluorine atom that is attached to a hydrogen atom. This interaction is the hydrogen bond, an interaction of the form A–H···B, where A and B are atoms of any of the three elements mentioned above and the hydrogen atom lies on a straight line between the nuclei of A and B (Figure 2.1).
2.3.1.6 Ionic Bonds
Salts like NaCl.
2.3.1.7 Chemical Bonds
The acid–base character of the substrate may influence the reactivity between adhesive and substrate. A covalent bond involves shared valence electrons (Figure 2.1).
2.4 Theories of Adhesion
According to Schultz and Nardin (1994), the main adhesion theories are as follows:
1 Mechanical interlocking
2 Electronic or electrostatic theory
3 Adsorption (thermodynamic) or wetting theory
4 Diffusion theory
5 Chemical (covalent) bonding theory
6 Theory of weak boundary layers and interphases
The adsorption hypothesis, which explains that adhesion is caused by intermolecular forces such as van der Waals forces, hydrogen bonds, and electrostatic interactions, is widely considered to be the most applicable to wood–polymer adhesion [7]. However, in a porous material like wood, penetration and mechanical interlocking must also play a significant role in the bonding process.
Marra [5] described adhesive bond formation in wood-based panels as a dynamic process consisting of flow, transference, penetration, wetting, and solidification (cure).
The mechanisms outlined above are not mutually exclusive since one or more of the above mechanisms can occur simultaneously depending on the specific conditions prevailing during bonding. The hierarchical cellular characteristics of wood offer such varied conditions.
The mechanical interlocking theory has long been used to explain wood bonding [6].
The electronic or electrostatic theory has been applied to wood in finishing and coating operations, although this adhesion bonding mechanism needs more fundamental research [21]. The adsorption or wetting theory has been exhaustively studied on wood over the past 40 years [7, 8].
The
