Handbook of Microwave Component Measurements. Joel P. Dunsmore

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1.28 shows the response of a mated pair of 1 mm male‐to‐male and female‐to‐female adapters (right scale) along with the same 1.85 mm mated pair of Figure 1.27 (left scale). The reference line is offset by 1 division to make it easier to see the traces; without the offset, the traces would lie nearly on top of each other. The mode for 1 mm is a bit of a deeper mode but is now out past 120 GHz. There is a second mode at 124 GHz, but both are also non‐propagating, so it may be possible to remove them with calibration. The depth of the mode does imply that it may be from the multiple beads in the mated pair and not be very stable with changes in temperature.

Graph depicts the response of a one mm mated pair and a 1.85 mm mated pair.

      1.8.2.9 PC Board Launches and Cable Connectors

Photo depicts the PC board scalar-mixer-calibration launches.

       1.8.3 Non‐coaxial Transmission Lines

      Transmission lines provide the interconnection between components, typically in a microcircuit or a PC board. These are distinguished from a measurement perspective because they are typically much shorter, often not shielded, and the interface to them is not easy to make and sometimes not well defined. While there have been whole books written on the subject, a short review of some common transmission line structures and their attributes are described next, with a focus on attributes important to measurement. Transmission lines are characterized by the same three parameters: impedance, effective dielectric constant, and loss.

      1.8.3.1 Microstrip

Schematic illustration of the planer transmission lines such as microstrip (a), coplanar waveguide (b), strip line (c).

      (1.86)equation

      where εre is the effective relative‐dielectric‐constant, found from

      (1.87)equation

      The effective relative‐dielectric constant sets the velocity factor of the transmission line, but in microstrip, some of the fields travel in the substrate and some in air. Therefore, the transmission is not purely transverse‐electromagnetic (TEM), and some structures become more difficult to design, particularly coupled lines, the even and odd mode velocity factors of which are not the equal. Since the line is not pure TEM, at high frequency, dispersion effects will become apparent where the effective delay of the line is not constant with frequency.

      The loss of microstrip lines is difficult to compute accurately because it depends upon many factors including the conductivity of the microstrip line and the ground plan, the dielectric loss of the substrate, radiated loss to the housing or shield, and losses related to both surface roughness and edge roughness. These roughness losses can be significant in PC board and low‐temperature cofired‐ceramic (LTCC) applications and are dependent upon the particular processes used. While there are high‐quality PC board materials (Duriod™ or GTEK™ are common trade names), the material known as FR4 is most common, and the dielectric constant and loss of this PC board material can be uncertain. The finished substrate can be comprised of layers of board material sandwiched together with glue, and the final thickness can depend upon processing steps, so it is best when evaluating microstrip transmission lines to produce sample structures that can help determine the exact nature of the material.

      One high‐performance material used is single‐crystal sapphire, and it has the unusual property of having a dielectric constant that has a directionality, with a higher constant of 10.4 in one of the three dimensions, and a lower constant of 9.8 in the other two. A second, common high‐performance dielectric is ceramic found in thin‐film, thick‐film, and LTCC applications. It has a uniform dielectric constant typically between 9.6 and 9.8 depending upon the purity and grain structure of the ceramic.

      1.8.3.2 Other Quasi‐Microstrip Structures

      1.8.3.3 Coplaner Waveguide

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