Self-Healing Smart Materials. Группа авторов

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Self-Healing Smart Materials - Группа авторов

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value was found to be ca. 10% for the cut and healed specimen, but for cracked then healed specimen η was ca. 44%. Although these results are not quite sufficient for a real-life application, the system can be improved and this study is the first report about intrinsically self-healable polybenzoxazines.

Schematic illustration of synthesis of a 1,3-benzoxazine and production of a polybenzoxazine therefrom.

      Films were prepared with different mass ratios of PPO-Benz and Benz-COOH by using solvent casting method. These films then cured at 180 °C before healing tests. Typically, the films were cut into two pieces and kept in contact for 12 h at room temperature. Then, the healing efficiencies of the healed films were found by tensile tests by calculating their toughness recovery. The extent of healing was found to be related to the added amount of Benz-COOH in the films. The cut films were able to restore themselves to certain degrees of healing (Figure 2.1). For example, healing efficiency was calculated as 96% for the polybenzoxazine film with 10% Benz-COOH but only 26% for the sample bearing 2.5% Benz-COOH. The findings clearly reveal that the number of hydrogen bonds is the major effect on recovery and the presence of Benz-COOH in curing formulations, as extra hydrogen bonding source, augments the self-mending ability.

Photo depicts the cut-healed PPO-Benz/Benz-COOH films.

      Figure 2.1 The images of cut-healed PPO-Benz/Benz-COOH films.

Schematic illustration of simplified mechanism of inverse vulcanization reaction of a benzoxazine monomer and elemental sulfur to produce a poly(benzoxazine-co-sulfide). Graph of stress–Strain (%) behavior of 5 times chopped and healed PPOBenz40%–B-ala40%–S20%.

      Figure 2.2 Stress–Strain (%) behavior of 5 times chopped and healed PPOBenz40%–B-ala40%–S20%.

      A typical self-healable film was prepared by dissolving PPO-Benz and BisBDiox (5% w/w) in tetrahydrofuran (THF) and then this solution was used to cast a thin layer on silicon wafers by spin coating technique. After drying, the obtained films had a thickness of ca. 300 nm. Then, these films were cured gradually by using an open-air oven at 180 °C and at 200 °C for ~30 min. To test healing, initially, the surface was scratched by using an atomic force microscopy (AFM) and its nano-indentation diamond tip. All the films were monitored by AFM in tapping mode before light exposure. Then, the films were exposed to light between 300 and 350 nm for 10 h under THF vapor at room temperature to trigger oxoketene formation. During irradiation, BisBDiox acted as bridging agent and polybenzoxazines chemically bind to each other over ester linkages

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