Скачать книгу
Adaptive Neuro‐Fuzzy Inference System
|
ANN
|
Artificial Neural Network
|
ANOVA
|
Analysis of Variance
|
ANSI
|
American National Standards Institute
|
APG
|
Absorptivity Profile Group
|
ASCII
|
American Standard Code For Information Interchange
|
ASTM
|
American Society for Testing and Materials
|
BD
|
Big Data
|
BESO
|
Bidirectional Evolutionary Structural Optimization
|
BJ
|
Binder Jetting
|
BJP
|
Binder Jet Printing
|
BP
|
Backpropagation
|
BSE
|
Backscattered Electrons
|
CAD
|
Computer‐Aided Design
|
CAE
|
Computer‐Aided Engineering
|
CAGR
|
Compound Annual Growth Rate
|
CAM
|
Computer‐Aided Manufacturing
|
CCD
|
Charged‐coupled device
|
CCT
|
Continuous Cooling Transformation
|
CDA
|
Constant Drawing Area
|
CET
|
Columnar‐to‐Equiaxed Transition
|
CFD
|
Computational Fluid Dynamics
|
CL
|
Cathodoluminescence
|
CMOS
|
Complementary Metal‐Oxide Semiconductor
|
CNC
|
Computer Numerical Control
|
CNN
|
Convolutional Neural Network
|
COLIN
|
Convex Linearization
|
CS
|
Crack Susceptibility
|
CT
|
Computed Tomography
|
μCT
|
micro Computed Tomography
|
CVD
|
Chemical Vapor Deposition
|
CW
|
Continuous Wave
|
DAE
|
Differential‐Algebraic Equation
|
DBN
|
Deep Belief Network
|
DC
|
Direct Current
|
DDA
|
Decreasing Drawing Area
|
DED
|
Directed Energy Deposition
|
DEM
|
Discrete/Dynamic Element Model
|
DfAM
|
Design for AM
|
DfM
|
Design for Manufacturing
|
DHA
|
Dust Hazard Analysis
|
DL
|
Deep Learning
|
DMLS
|
Direct Metal Laser Sintering
|
DoD
|
Drop‐on‐Demand
|
DoG
|
Difference of Gaussian
|
DXF
|
Drawing Exchange Format
|
EA
|
Electrical Arc
|
EAM
|
Embedded‐Atom Method
|
EB
|
Electron Beam
|
EBAM
|
Electron Beam Additive Manufacturing
|
EB‐DED
|
Electron Beam Directed Energy Deposition
|
EBF3
|
Electron Beam Freeform Fabrication
|
EBF
3
|
Electron Beam Fusion
|
Скачать книгу