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Table of Contents
1 Cover
3 Preface
5 1 Introduction 1.1 Background 1.2 The Idea 1.3 Exploring the Idea 1.4 Developing the Idea into a Mainstream Technology 1.5 Concluding Remarks Acknowledgements References
6 2 Antennas 2.1 Introduction 2.2 Basic Antennas 2.3 Unusual Antennas 2.4 Microstrip Patch Antennas 2.5 Microstrip Grid Array Antennas 2.6 Yagi‐Uda Antennas 2.7 Magneto‐Electric Dipole Antennas 2.8 Performance Improvement Techniques 2.9 Summary Acknowledgements References
7 3 Packaging Technologies 3.1 Introduction 3.2 Major Packaging Milestones 3.3 Packaging Taxonomy 3.4 Packaging Process for Several Major Packages 3.5 Summary and Emerging Trends References
8 4 Electrical, Mechanical, and Thermal Co‐Design 4.1 Introduction 4.2 Electrical, Warpage, and Thermomechanical Analysis for AiP Co‐design 4.3 Thermal Management Considerations for Next‐generation Heterogeneous Integrated Systems Acknowledgment References
9 5 Antenna‐in‐Package Measurements 5.1 General Introduction and Antenna Parameters 5.2 Impedance Measurements 5.3 Anechoic Measurement Facility for Characterizing AiPs 5.4 Over‐the‐air System‐level Testing 5.5 Summary and Conclusions References Note
10 6 Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms 6.1 Introduction 6.2 LTCC Technology 6.3 LTCC‐based AiP 6.4 Challenges and Upcoming Trends in LTCC AiP References
11 7 Antenna Integration in Packaging Technology operating from 60 GHz up to 300 GHz (HDI‐based AiP) 7.1 Organic Packaging Technology for AiP 7.2 Integration of AiP in Organic Packaging Technology Below 100 GHz 7.3 Integration of AiP in Organic Packaging Technology in the 120–140‐GHz Band 7.4 Integration of AiP in Organic Packaging Technology Beyond 200 GHz 7.5 Conclusion and Perspectives References
12 8 Antenna Integration in eWLB Package 8.1 Introduction 8.2 The Embedded Wafer Level BGA Package 8.3 Toolbox Elements for AiP in eWLB 8.4 Antenna Integration in eWLB 8.5 Application Examples 8.6 Conclusion Acknowledgement References NOTE
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