Additive Manufacturing AiP Designs and Applications
9.1 Introduction
9.2 Additive Manufacturing Technologies
9.3 Material Characterization
9.4 Recent Advances in AM for Packaging
9.5 Fabrication Process
9.6 AiP and SoP using AM Technologies
9.7 Summary and Prospect
References
14 10 SLC‐based AiP for Phased Array Applications 10.1 Introduction 10.2 SLC Technology 10.3 AiP for 5G Base Station Applications 10.4 94‐GHz Scalable AiP Phased‐array Applications Acknowledgment References
15 11 3D AiP for Power Transfer, Sensor Nodes, and IoT Applications 11.1 Introduction 11.2 Small Antenna Design and Miniaturization Techniques 11.3 Multi‐mode Capability: A Way to Achieve Wideband Antennas 11.4 Miniaturized Antenna Solutions for Power Transfer and Energy Harvesting Applications 11.5 AiP Solutions in Low‐cost PCB Technology References
16 Index
List of Tables
1 Chapter 2Table 2.1 Dimensions of magneto‐electric dipole antennas.Table 2.2 Measured gain of magneto‐electric dipole antennas.
2 Chapter 4Table 4.1 Co‐design considerations of implementing a multilayer organic AiP M...Table 4.2 Peak chip power density of reported silicon‐based mmWave phased arr...Table 4.3 Thermal simulation specifications for the AiP prototype.Table 4.4 Temperature measurement of one active chip for thermal characteriza...
3 Chapter 5Table 5.1 Motor movements during various types of antenna measurements.Table 5.2 Antenna design requirements of the circularly polarized rod antenna...Table 5.3 Measurement methods to determine antenna polarization characteristi...Table 5.4 Uncertainty caused by the motor movements and positioning of the AU...
4 Chapter 6Table 6.1 Characteristics of LTCC material systems.Table 6.2 Worldwide LTCC foundries.
5 Chapter 7Table 7.1 Examples of industrial CCL materialTable 7.2 Examples of industrial RCC material provided by Ajinomoto (https://...Table 7.3 Current PTH and μvia diameters supported in the packaging ...Table 7.4 Design rules for SUB, SAP, mSAP and ETS processesTable 7.5 Number of parts per strip in function of substrate body sizeTable 7.6 Antenna final dimensions
6 Chapter 8Table 8.1 Parameters of transmission lines realizable in the eWLB for line/sp...Table 8.2 Layout parameters and measured performance of the single‐layer spir...Table 8.3 Wavelengths at selected frequencies for
7 Chapter 9Table 9.1 Physical dimensions of the broadband AiP design.
8 Chapter 10Table 10.1 State‐of‐the‐art phased‐array survey.Table 10.2 Measured antenna performance comparison.
9 Chapter 11Table 11.1 Desired antenna features in scavenging and transmitting mode
List of Illustrations
1 Chapter 1Figure 1.1 Micrograph of the first 2.4‐GHz CMOS wireless SoC, a Bluetooth radi...Figure 1.2 Photographs of the first 60‐GHz SiGe radio chipset: (a) transmitter...Figure 1.3 Photograph of a microchip.Figure 1.4 Photographs showing the evolution of the integration of antenna in ...Figure 1.5 Photograph of IBM chip‐scale package with integrated chips and ante...Figure 1.6 Captured images and photographs of AiP for IBM 60‐GHz SiGe chip set...
2 Chapter 2Figure 2.1 Structure of a basic patch antenna and coordinate system.Figure 2.2 Structure of a stacked patch antenna and coordinate system.Figure 2.3 Photograph of a stacked patch antenna.Figure 2.4 Simulated and measured |S11| of a stacked patch antenna.Figure 2.5 Simulated and measured gain of a stacked patch antenna.Figure 2.6 Photograph of a linearly polarized 2×4 patch antenna arr...Figure 2.7 Photograph of a circularly polarized 4×4 patch antenna a...Figure 2.8 Photograph of a switched‐beam patch antenna array (from...Figure 2.9 Photograph of a phased array (from [11], © 2011 IEEE, re...Figure 2.10 Structure of a microstrip grid array antenna and coordinate ...Figure 2.11 Photograph of a dual‐feed microstrip grid array antenna.Figure 2.12 Simulated and measured results (a) |Sd11...Figure 2.13 Simulated and measured radiation patterns of a dual‐fe...Figure 2.14 Simulated and measured radiation patterns of a dual‐fe...Figure 2.15 Simulated and measured gain values of a dual‐feed
