Design for Excellence in Electronics Manufacturing. Cheryl Tulkoff

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3.17 Images of solder coarsening.Figure 3.18 Tin whiskers.Figure 3.19 Tin whisker intermetallic formation.Figure 3.20 Detailed geometry and mesh of traces and vias.Figure 3.21 Detailed view of high‐ and low‐stress pads.Figure 3.22 Immersion silver galvanic etching.Figure 3.23 Champagne voiding.Figure 3.24 Creep corrosion.Figure 3.25 Compression on a PTH from ICT.Figure 3.26 PTH barrel crack.Figure 3.27 Conductive anodic filament formation.Figure 3.28 Conductive anodic filament example.Figure 3.29 Hollow fiber example.Figure 3.30 Strain level from a 50 G mechanical shock.Figure 3.31 Example of excessive strain.Figure 3.32 Reduced strain after mount points are added.Figure 3.33 Corner staking, edge bonding, and underfill.Figure 3.34 Pad cratering cross section.Figure 3.35 Examples: dendrite (top) and CAF (bottom).Figure 3.36 Electrodissolution.Figure 3.37 E‐Field and dendritic growth.Figure 3.38 Non‐functional pads example.Figure 3.39 Typical bathtub curve.Figure 3.40 Conformal coating Tg behavior.

      3 Chapter 4Figure 4.1 Changes to the typical bathtub curve.Figure 4.2 MLCC life expectancy.Figure 4.3 Temperature variation in a trucking container.Figure 4.4 Failure load conditions.Figure 4.5 Power cycling.Figure 4.6 Manufacturing operations impacting bending.Figure 4.7 Cracked capacitor and pad cratering.Figure 4.8 Strain gauge.Figure 4.9 Vibration durability issue 1.Figure 4.10 Vibration durability issue 2.Figure 4.11 Preconditioning Weibull slope change.Figure 4.12 Acceleration factor calculations.Figure 4.13 Potential failure modes and tests.

      4 Chapter 5Figure 5.1 Cost increases associated with DfM implementation.Figure 5.2 IPC Standards 2019.Figure 5.3 Thermal stress crack.Figure 5.4 Visible thermal stress crack..Figure 5.5 Vertical crack under termination..Figure 5.6 Mechanical shock failure modes..Figure 5.7 ICT fixture.Figure 5.8 Resistor damaged by sulfur dioxide..Figure 5.9 IC wearout concern.Figure 5.10 Surface finishes.Figure 5.11 Black pad images.Figure 5.12 Silver creep..Figure 5.13 PTH failure..Figure 5.14 CAF examples..Figure 5.15 QFN bondline.Figure 5.16 QFN I/O pad and thin bondline.Figure 5.17 Windowpane stencil structure.Figure 5.18 Solder paste volume change..Figure 5.19 CTE and modulus change.Figure 5.20 Cleaning process considerations.

      5 Chapter 6Figure 6.1 Kirkendall or champagne voids.Figure 6.2 Counterfeit definitions.Figure 6.3 Basic validation process flow.Figure 6.4 Plating voids.Figure 6.5 Glass fiber protrusion.Figure 6.6 Plating folds.Figure 6.7 Plating nodules.Figure 6.8 Etch pits.

      6 Chapter 7Figure 7.1 Problem‐solving vs. root cause problem‐solving.Figure 7.2 The eight disciplines process.Figure 7.3 Scanning acoustic microscopy system.Figure 7.4 Through transmission acoustic microscopy.Figure 7.5 Peak amplitude acoustic microscopy.Figure 7.6 Phase inversion acoustic microscopy.Figure 7.7 X‐ray microscopy.Figure 7.8 Thermal imaging.Figure 7.9 Superconducting quantum interfering device microscopy.Figure 7.10 Decapsulation system.Figure 7.11 Cross‐section polishing.Figure 7.12 Cross‐section of a BGA.Figure 7.13 Scanning electron microscope system.Figure 7.14 SEM EDX spectra.Figure 7.15 Xyztec combination wire bond and shear tester.Figure 7.16 Fourier transform system.Figure 7.17 Ion chromatography system.Figure 7.18 Digital image correlation setup.Figure 7.19 Plan‐do‐check‐act process.

      Guide

      1  Cover

      2  Table of Contents

      3  Begin Reading

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      Series Title

      Wiley Series in Quality & Reliability Engineering

Dr. Andre Kleyner

       Series Editor

      The Wiley Series in Quality & Reliability Engineering aims to provide a solid educational foundation for both practitioners and researchers in the Q&R field and to expand the reader's knowledge base to include the latest developments in this field. The series will provide a lasting and positive contribution to the teaching and practice of engineering.

      The series coverage will contain, but is not exclusive to,

       Statistical methods

       Physics of failure

       Reliability modeling

       Functional safety

       Six‐sigma methods

       Lead‐free

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