mistakes over and over. We found that both unfortunate and discouraging. We were unable to find a comprehensive how‐to guide and felt we had a unique opportunity to help prevent problems from recurring.
We wrote this book for electronics design, manufacturing, and reliability engineers and those who work with them. We wanted to create a practical guide containing tools, tips, and solutions to help engineers create high‐quality, high‐reliability products. We sincerely hope we have succeeded.
April 2021
Cheryl Tulkoff and Greg Caswell
Austin, Texas, USA
Acknowledgments
The authors would like to thank the engineering teams at Ansys‐DfR Solutions and National Instruments for their support during the development of this book. We would particularly like to thank Dr. Craig Hillman, Dr. Nathan Blattau, Jim McLeish, Dr. Randy Schueller, and Seth Binfield for exceptional technical input in their areas of expertise. Their contributions made the book a more comprehensive resource.
We would like to recognize Ken Symonds for performing a detailed review of the entire book and offering numerous editorial comments that significantly enhanced it. His input on grammar and complexity also made the book infinitely more readable.
Andre Kleyner provided the critical initial nudge and persistent support in driving us to make the book a reality. Ella Mitchell at Wiley secured the technical reviews for us at the concept stage and made sure all of the important paperwork got done.
We'd like to express our gratitude to our peers and students from the electronics industry organizations that we have taught and volunteered for over the years, including IPC, SMTA, iMAPS, IEEE, and ASQ. Their questions, feedback, and knowledge have greatly informed this book.
Finally, we would like to thank our respective companies and families for giving us the time to bring the entire manuscript together. We hope you find it useful.
Cheryl Tulkoff and Greg Caswell
Acronyms
2Dtwo‐dimensional3Dthree‐dimensionalAABUSas agreed between user and supplierACalternating currentADAautomated design analysisAFacceleration factorAFSCAir Force Systems CommandAgsilverALTaccelerated life testAMRabsolute maximum ratingANSIAmerican National Standards InstituteAOIautomated optical inspectionASTMAmerican Society for Testing and MaterialAVLapproved vendor listBGAball grid arrayBISTbuilt in self‐testBOMbill of materialsBTCbottom termination componentCcentigradeC0Gtemperature‐stable dielectricCADcomputer‐aided designCAFconductive anodic filamentCAMcomputer‐aided manufacturingCAPEXcomponent cost and installation expenseCARcorrective action requestCBGAceramic ball grid arrayCCAcircuit card assemblyCDMcharged device modelCFFconductive filament formationCIcontinuous improvementcmcentimeterCMcontract manufacturerCMOScomplementary metal oxide semiconductorCOBchip on boardCOPcomputer operating properlyCOTScommercial off the shelfCPUcentral processing unitC‐SAMC‐mode scanning acoustic microscopyCSPchip‐scale packageCTEcoefficient of thermal expansionCTQcritical to qualityCTScompatibility test suiteCucopperCVDchemical vapor depositionDCdirect currentDfMDesign for ManufacturabilityDFMEAdesign failure modes and effects analysisDfRDesign for ReliabilityDfSDesign for SustainabilityDfTDesign for TestDfXDesign for ExcellenceDIdeionizedDICdigital image correlationDIPdual inline packageDMAdimethylacetamide; dynamic mechanical analysisDMFdimethylformamideDMSMSdiminishing manufacturing sources and material shortagesDoDUS Department of DefenseDPMOdefects per million opportunitiesDRAMdynamic random access memoryDRBdata‐retention bakeDRBFMdesign review by failure modeDRCdesign rule checkDSCdifferential scanning calorimetryDUTdevice under testEaactivation energyEAengineering authorityEBICelectron beam induced currentECMelectrochemical migrationECNengineering change noticeEDAelectronic design automationEDRelectronics design reliabilityEDXenergy dispersive X‐ray spectroscopyEEEelectrical, electronic, electromechanicalEFATextended factory acceptance testEMelectromigrationEMCelectromagnetic compatibilityEMIelectromagnetic interferenceEMSelectronic manufacturing servicesENDendurance testENEPIGelectroless nickel / electroless palladium / immersion goldENIGelectroless nickel / immersion goldEOLend of lifeEOSelectrical overstressEPDMethylene propylene diene monomerERCelectrical rule checkESDelectrostatic dischargeESRequivalent series resistanceESSelectrical stress screening; environmental stress screeningeVelectron voltsF3form, fit, and functionFAfailure analysisFARFederal Acquisition RegulationsFATfactory acceptance testFEAfinite element analysisFETfield effect transistorFIBfocused ion beamFIFOfirst in, first outFITfailures in timeFMEAfailure modes and effects analysisFMECAfailure modes, effects, and criticality analysisFR4fire retardant 4FRACASFailure Reporting, Analysis, and Corrective Action SystemFTAfault‐tree analysisFTIRFourier transform infrared spectroscopyGBLy‐butyrolactoneGEIAGovernment Electronics and Information Technology AssociationGHzgigahertzGNDgroundGrmsgravity root mean squareHALThighly accelerated life testingHASAhighly accelerated stress auditHASLhot air solder levelingHASShighly accelerated stress screening;HASThighly accelerated stress test; highly accelerated stress testingHATShighly accelerated thermal shockHBMhuman body modelHCFhigh cycle fatigueHCIhot carrier injectionHDDhard disk driveHDIhigh‐density interconnectHPLChigh‐performance liquid chromatographyHTOLhigh‐temperature operating lifeI/Oinput/outputICintegrated circuitICTin‐circuit test; ion chromatography testingIDidentificationIDMintegrated device manufacturerIECInternational Electrotechnical CommissionIEEEInstitute of Electrical and Electronics EngineersImAgimmersion silverIMCintermetallic growthImSnimmersion tinIPCassociation connecting electronics industriesIRinfraredISOInternational Organization for StandardizationISTintegrated system testJEDECJoint Electronic Devices Engineering CouncilJPLJet Propulsion LaboratoryJTAGJoint Task Action GroupKClpotassium chlorideKPIkey performance indicatorLCCCleadless ceramic chip carrierLCDliquid crystal displayLCFlow cycle fatigueLCRinductance‐capacitance‐resistanceLEDlight‐emitting diodeLFlead‐freeLGAland‐grid arrayLPIliquid photo imageableLTSlong‐term storageLUlatch upMBBmoisture barrier bagMCMmulti‐chip modulesMCM‐Lmulti‐chip module ‐ laminateMEMSmicro‐electro‐mechanical systemMFGmixed flowing gasMHzmegahertzMILmilitaryMIL‐HDBKmilitary handbookMIL‐SPECmilitary specificationMLCCmulti‐layer ceramic capacitormmmillimeterMMmachine modelMnO2manganese dioxideMRP/ERPmaterials requirements planning/enterprise resource planningMSLmoisture sensitivity levelMSPmanaged supply programMTBFmean time between failuresMTTFmean time to failureNaClsodium chlorideNASANational Aeronautics and Space AdministrationNAVSEANaval Sea Systems CommandNBTInegative bias temperature instabilityNDEnon‐destructive evaluationsNISTNational Institute of StandardsnmnanometerNPInew product introductionNREnon‐recurring expenseNSMDnon‐soldermask definedNTFno trouble foundOBICoptical beam induced currentODMoriginal design manufacturerOEMoriginal equipment manufacturerOPEXoperation/maintenance/intervention expenseORTongoing reliability test; ongoing reliability testingOSPorganic solderability preservativePbleadPCpersonal computerPCBprinted circuit boardPCBAprinted circuit board assemblyPCMCIAPersonal Computer Memory Card International AssociationPCNprocess change noticePCQR2printed board capability, quality, and relative reliabilityPESDpolymer electro‐static discharge devicePFMEAprocess failure modes and effects analysisPGApin‐grid arraypKaacid disassociation constantPLLphase‐locked loopPoFphysics of failurePoPpackage on packageppbparts per billionppmparts per millionPSDpower spectral densityPTHplated through‐holePWBprinted wiring boardPWRpowerQBRquarterly business reviewQCIqualification conformance inspectionQFDquality functional deployment (house of quality)QFNquad flat‐pack no‐leadsQFPquad flat‐packRADCRome Air Development CenterRCARadio Corporation of AmericaRDTreliability demonstration testingREACHRegistration, Evaluation, Authorization and Restriction of Chemical SubstancesRFradio frequencyRGTreliability growth testRHrelative humidityRIACReliability Information Analysis CenterRMArosin, mildly activatedROrosin onlyROCrecommended operating conditionsRoHSRestriction of the Use of Certain Hazardous Substances in Electrical and Electronic EquipmentROIreturn on investmentROL0rosin low, flux type L0ROL1rosin low, flux type L1ROSEresistivity of solvent extractRPAreliability physics analysisSACtin/silver/copper (Sn/Ag/Cu)SAC305tin silver
