Flexible Supercapacitors. Группа авторов

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in wearable electronics.

      2.2.1.3 Fabrication of Stretchable Coaxial SCs

Schematic illustrations of the fabrication procedures for coaxial SCs and corresponding electrochemical performances at different tensile strains. (a, b) Pre–stretching substrate and electrode.

      Source: Reproduced with permission [36]. © 2013, Wiley‐VCH.

      (c, d) Over‐twisting the SCs device into a helical structure. (e) Areal specific capacitance variations with scan rates.

      Source: Reproduced with permission [60]. © 2016, Wiley‐VCH.

      2.2.2 Planar Stretchable SCs

      Stretchable 2D planar SCs with excellent properties of small size, low weight, excellent lifespan, high security and easy integration have become a preferred choice as energy storage to power the wearable electronics [37, 61–63]. There are two main categories including layer by layer sandwich structure and micro supercapacitors (MSCs). The fabrication method of the 2D planar stretchable SCs is similar to 1D fiber shaped SCs. One is via embedding rigid independent devices to the stretchable substrate or establishing serpentine interconnects between rigid devices to realize stretchability. Another one is replacing the rigid unit by stretchable component. In this section, we will introduce the typical fabrication method reported during the last few years.

      2.2.2.1 Fabrication of the Stretchable Planar SCs with Sandwich Structure

      Most of the deformable substrate used in the field of stretchable SCs is PDMS. In 2014, Xie et al. reported a flat Ni foam based stretchable all‐solid‐state SC with wavy shaped polyaniline (PANI)/graphene electrode [65]. Figure 2.6d showed the schematics of the fabrication process for fabricating the PANI/graphene electrodes based stretchable SCs. First, a flat Ni foam with a thickness of 200 mm was manually made into a wavy shape, next, the porous graphene was synthesized on the buckled Ni foam via atmospheric pressure chemical vapor deposition (CVD). Then the graphene coated Ni foam was put in a solution of 3 M HCl to etch nickel foam to obtain wavy‐shaped graphene film. In order to improve the electrochemical performance of the SCs, the PANI was deposited on the wavy shaped graphene film. Finally, two PANI covered graphene films with PVA/H3PO4 wall were encapsulated into Elastic substrate (Ecoflex). Figure 2.6e depicted

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