Antenna-in-Package Technology and Applications. Duixian Liu
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Library of Congress Cataloging‐in‐Publication data applied for
ISBN: 9781119556633
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List of Contributors
Yueping Zhang
School of Electrical and Electronic Engineering
Nanyang Technological University
Singapore
Ning Ye
Package Technology Development & Integration
Milpitas
USA
Xiaoxiong Gu
Thomas. J. Watson Research Center, IBM
New York
USA
Pritish Parida
Thomas. J. Watson Research Center, IBM
New York
USA
A.C.F. Reniers
Department of Electrical Engineering
Eindhoven University of Technology (TU/e)
Eindhoven
The Netherlands
U. Johannsen
Department of Electrical Engineering
Eindhoven University of Technology (TU/e)
Eindhoven
The Netherlands
A.B. Smolders
Department of Electrical Engineering
Eindhoven University of Technology (TU/e)
Eindhoven
The Netherlands
Atif Shamim
Computer, Electrical and Mathematical Sciences and Engineering Division
King Abdullah University of Science & Technology (KAUST)
KSA
Haoran Zhang
Computer, Electrical and Mathematical Sciences and Engineering Division
King Abdullah University of Science & Technology (KAUST)
KSA
Frédéric Gianesello
ST Microelectronics
Technology R&D
Silicon Technology Development
Crolles
France
Diane Titz
Université Nice Sophia Antipolis
Polytech'Lab
Biot
France
Cyril Luxey
Université Nice Sophia Antipolis
Polytech'Lab
Biot
France
Maciej Wojnowski
Infineon Technologies AG
Neubiberg
Germany
Klaus Pressel
Infineon Technologies AG
Regensburg
Germany
Tong‐Hong Lin
The School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta
USA
Ryan A. Bahr
The School of Electrical and Computer Engineering
Georgia Institute of Technology