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has a cubic geometry with radiating antennas on its surrounding faces. The chapter highlights small antenna design and miniaturizing techniques as well as multi‐mode capability as a way to achieve wideband antennas.
This book is the result of the joint efforts of the 21 authors in eight different institutions in Asia, Europe, and the United States. A book on an emerging topic like AiP technology would not have been possible without such collaborations. We thank all authors for their creative contributions and careful preparation of manuscripts. We are also pleased to acknowledge the professional cooperation of the publishers.
Duixian Liu IBM Thomas J. Watson Research Center Yorktown Heights, NY, USA
Yueping Zhang School of Electrical and Electronic Engineering Nanyang Technological University Singapore
Abbreviations
| 2D | two‐dimensional | |
| 3D | three‐dimensional | |
| 3GPP | 3rd Generation Partnership Project | |
| 5G | fifth‐generation | |
| ABS | acrylonitrile butadiene styrene | |
| ACE | Advanced Semiconductor Engineering, Inc. | |
| ACP | aperture‐coupled patch | |
| ADS | Advanced Design System | |
| AIA | active integrated antenna | |
| AiM | antenna in a module | |
| AiP | antenna‐in‐package | |
| AM | additive manufacturing | |
| AMC | artificial magnetic conductor | |
| AoB | antenna on a board | |
| AoC | antenna on a chip | |
| AR | axial ratio | |
| ARM | advanced reduced‐instruction set‐computer machine | |
| ASIC | application‐specific integrated circuit | |
| ASUT | antenna system under test | |
| AUT | antenna under test | |
| Az | azimuth | |
| BCB | benzocyclobutene | |
| BC‐SRR | broadside‐coupled SRR | |
| BER | bit error rate | |
| BERT | BER tester | |
| BiCMOS | bipolar complementary metal oxide semiconductor | |
| BGA | ball grid array | |
| BLE | Bluetooth low energy | |
| BT | Bluetooth | |
| BT | bismaleimide triazine | |
| BW | bandwidth | |
| C4 | controlled collapse chip connection | |
| CATR | compact antenna test range | |
| CCL | copper‐clad laminate | |
| CLIP | continuous liquid interface printing | |
| CMA | characteristic mode analysis | |
| CMF | conjugate match factor | |
| CMG | conjugate match gain | |
| CMOS | complementary metal‐oxide semiconductor | |
| CNC | computer numerical controlled | |
| CP | circular polarization | |
| CPS | coplanar strip | |
| CPU | central processing unit | |
| CPW | coplanar waveguide | |
| CT | computer tomography | |
| CTE | coefficient of thermal expansion | |
| CUF | capillary underfill | |
| DC | direct current | |
| DLP | digital light projection | |
| DMA | dynamic mechanical analysis | |
| DRAM | dynamic random‐access memory | |
| DRIE | deep reactive ion etching | |
| EBG | electromagnetic bandgap | |
| EIRP | equivalent isotropic radiated power | |
| El | elevation | |
| EM | electromagnetic | |
| EMI | electromagnetic interference | |
| ESD | electrostatic discharge | |
| ETS | embedded traces | |
| eWLB | embedded wafer‐level ball grid array | |
| EZL | embedded Z line |
