Antenna-in-Package Technology and Applications. Duixian Liu

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has a cubic geometry with radiating antennas on its surrounding faces. The chapter highlights small antenna design and miniaturizing techniques as well as multi‐mode capability as a way to achieve wideband antennas.

      This book is the result of the joint efforts of the 21 authors in eight different institutions in Asia, Europe, and the United States. A book on an emerging topic like AiP technology would not have been possible without such collaborations. We thank all authors for their creative contributions and careful preparation of manuscripts. We are also pleased to acknowledge the professional cooperation of the publishers.

      Duixian Liu IBM Thomas J. Watson Research Center Yorktown Heights, NY, USA

      Yueping Zhang School of Electrical and Electronic Engineering Nanyang Technological University Singapore

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2D two‐dimensional
3D three‐dimensional
3GPP 3rd Generation Partnership Project
5G fifth‐generation
ABS acrylonitrile butadiene styrene
ACE Advanced Semiconductor Engineering, Inc.
ACP aperture‐coupled patch
ADS Advanced Design System
AIA active integrated antenna
AiM antenna in a module
AiP antenna‐in‐package
AM additive manufacturing
AMC artificial magnetic conductor
AoB antenna on a board
AoC antenna on a chip
AR axial ratio
ARM advanced reduced‐instruction set‐computer machine
ASIC application‐specific integrated circuit
ASUT antenna system under test
AUT antenna under test
Az azimuth
BCB benzocyclobutene
BC‐SRR broadside‐coupled SRR
BER bit error rate
BERT BER tester
BiCMOS bipolar complementary metal oxide semiconductor
BGA ball grid array
BLE Bluetooth low energy
BT Bluetooth
BT
BW bandwidth
C4 controlled collapse chip connection
CATR compact antenna test range
CCL copper‐clad laminate
CLIP continuous liquid interface printing
CMA characteristic mode analysis
CMF conjugate match factor
CMG conjugate match gain
CMOS complementary metal‐oxide semiconductor
CNC computer numerical controlled
CP circular polarization
CPS coplanar strip
CPU central processing unit
CPW coplanar waveguide
CT computer tomography
CTE coefficient of thermal expansion
CUF capillary underfill
DC direct current
DLP digital light projection
DMA dynamic mechanical analysis
DRAM dynamic random‐access memory
DRIE deep reactive ion etching
EBG electromagnetic bandgap
EIRP equivalent isotropic radiated power
El elevation
EM electromagnetic
EMI electromagnetic interference
ESD electrostatic discharge
ETS embedded traces
eWLB embedded wafer‐level ball grid array
EZL embedded Z line