Federal Communications Commission
|
|
FDM
|
fused‐deposition modeling
|
|
FE
|
front end
|
|
FF
|
far‐field
|
|
FMCW
|
frequency modulated continuous wave
|
|
FoM
|
figure of merit
|
|
FO PoP
|
fan‐out package‐on‐package
|
|
FO‐WLP
|
fan‐out wafer‐level packaging
|
|
FPGA
|
field‐programmable gate array
|
|
FR4
|
flame resistant 4
|
|
FSS
|
frequency selective surface
|
|
GaAs
|
gallium arsenide
|
|
GaN
|
gallium nitride
|
|
Gb/s
|
gigabit per second
|
|
GPU
|
graphics processing unit
|
|
GSG
|
ground‐signal‐ground
|
|
GSGSG
|
ground‐signal‐ground‐signal‐ground
|
|
GSM
|
global system for mobile communications
|
|
HAST
|
highly accelerated stress test
|
|
HBM
|
high bandwidth memory
|
|
HDI
|
high‐density integration
|
|
HDI
|
high‐density interconnect
|
|
HFSS
|
high‐frequency structure simulator
|
|
HPBW
|
half‐power beam width
|
|
HTCC
|
high‐temperature co‐fired ceramics
|
|
IC
|
integrated circuit
|
|
IEEE
|
Institute of Electrical and Electronics Engineers
|
|
IF
|
intermediate frequency
|
|
InFO_PoP
|
integrated fan out package on package
|
|
I/O
|
input/output
|
|
IoT
|
Internet of Things
|
|
ISM
|
industrial, scientific and medical
|
|
ISSCC
|
International Solid‐State Circuits Conference
|
|
JPL
|
jet propulsion laboratory
|
|
LCD
|
liquid crystal display
|
|
LCP
|
liquid crystal polymer
|
|
LGA
|
land grid array
|
|
LHCP
|
left‐hand circular polarization
|
|
LNA
|
low‐noise amplifier
|
|
LP
|
linearly polarized
|
|
LTCC
|
low‐temperature co‐fired ceramic
|
|
MACM
|
multiple amplitude component method
|
|
MAPCM
|
multiple amplitude phase component method
|
|
MCM
|
multi‐chip module
|
|
MEMS
|
micro‐electromechanical systems
|
|
MIM
|
metal–insulator–metal
|
|
MIMO
|
multiple input multiple output
|
|
MMIC
|
monolithic microwave integrated circuit
|
|
MMWAC
|
mmWave anechoic chamber
|
|
mmWave
|
millimeter‐wave
|
|
mSAP
|
modified semi‐additive process
|
|
MUF
|
molded underfill
|
|
NF
|
near‐field
|
|
NF
|
noise figure
|
|
NIST
|
National Institute of Standards and Technology
|
|
NRE
|
non‐recurring engineering
|
|
NRW
|
Nicholson–Ross–Weir
|
|
OTA
|
over‐the‐air
|
|
PAE
|
power‐added efficiency
|
|
PAM
|
phase amplitude method
|
|
PBO
|
polybenzoxazoles
|
|
PCB
|
printed circuit board
|
|
PEC
|
perfect electric conductor
|
|
PER
|
packet error rate
|
|
PET
|
polyethylene terephthalate
|
|
pHEMT
|
pseudomorphic high electron mobility transistor
|
|
PI
|
polyimide
|
|
PLA
|
polylactic acid
|
|
PLL
|
|
